My first criticism would be the reflow job on the header pins. It looks like several of the pins, particularly the middle had gotten twisted when they were heated. This would lessen the contact with the connector pins
2nd, when they were reflowed, new solder was placed on the pins without removing the old solder first. I question how good a bond the solder has with those pins.
3rd, the pin on the right, with the wire repair, the wire is sitting high up on the pin, and will prevent the connector from seating properly
4th - that wire doesn't seem to have a great solder-bond with that pin.
Next, instead of running that wire repair, maybe it's possible to repair the existing trace?
Scrape the coating off the trace (carefully) maybe 1/4 inch up to the solder pad, then extend the solder mound onto the trace itself
lampboard2 (resized).jpg
Can offer more thoughts, if interested.