Quoted from Neal_W:Mounted under the playfield they get hammered and with the components hanging there, it's not hard to imagine solder joints and headers fail.
Unless the components are getting hot enough to melt their own solder ... then the SMT solder connections shouldn't be affected by the vibration.
Personally; I think that Stern has a design defect or two... or they are trying to update the FW on the node board which fails... leading to massive rejects on new code updates... or they are frying the components on the node board due to ESD or Coil EMF.
Given how cheap Stern has gotten... I wouldn't surprise me if the reason they have so many versions of the node boards is because several different engineers are trying to "fix" a bad design. I'm BETTING that stern did very little reliability studies with the existing boards... probably no "temperature" chamber checks.
We don't hold them accountable... so they aren't going to be accountable.