Gaborone
I don't find it strange at all - a guy comes on here helping the community and 50% of the posts here are hammering him - what do you expect?
Flame away entitled millennials - hahahaha
(Topic ID: 277649)
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Not a great look BUT I would be inclined to just solder them on and use the board. Think of it as a "partial kit".
If I received a board with parts not soldered I would certainly carefully study the entire board and confirm everything else is soldered well before installing it.
4 months later
Quoted from metallik:Pinball_Basement How are these top traces connected to the IC? You can't ship this stuff until you fix the manufacturing process.
[quoted image]
I agree it isn't good BUT they will be connected top the top traces via the 'vias' - the plated through holes in the PCB.
As long as they are soldered on the bottom this won't prevent connections.
2 months later
PCBs are never "soldered both sides". You don't understand the process.
Wave soldering does exactly that - it creates a 'wave' of solder that sweeps across the BOTTOM of the PCB as it passes over the wave - usually dragged past by a chain. Through hole boards are NEVER soldered on the top.
If temps and speed of the driven chain are all set correctly the solder will usually wick through the holes but not always.
Quoted from kungfucop:You are probably right. But I swear I saw long ago on some documentary using robotic / automated assembly setups where boards are dipped into a solder wave deep enough to cover both sides and then a channel of pressurized air would simultaneously remove the excess.
Doubt it, it would damage components. As it is, you really have to watch temps VERY carefully with a wave soldering machine to avoid damaging parts so I can't see how dunking the entire board would ever be a thing? Certainly never in my travels over many years and to many assembly houses have I ever seen anything like this.
Quoted from ForceFlow:I've seen that dunking process as well. I too was curious how they did it without harming the components.
Yes, there is a "dunking" method but the board is not entirely submerged - it is lowered into the molten solder until surface tension just prevents it from flowing onto the top of the board.
You can even do it yourself using a frypan, spray flux onto the underside of the PCB with parts then lower it so the board is just touching the surface of the molten solder. Wave the board around a little, side to side and withdraw it vertically and it should come away cleanly.
pan (resized).pngQuoted from ForceFlow:I've seen the solder pot method before, and that's not the one that's a mystery.
What I was curious about was complete or near complete submersion.
Solder pots are almost always for tinning the end of wires from my experience not soldering completed boards.
Completely submerging the components would surely not be within the specs for any parts I know of. That's not to say people don't do it but it would be courting disaster IMO.
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