I’m doing a PIA swap out and adding a socket in the process. I’ve been using practice kits for the last few months to get a handle but still having a little trouble getting enough solder to flow through the channel to the pad on the opposite side. When I supply more solder I get a convex blob instead. I *am* making contact with the lead and pad for about a second before adding solder via a bridge to the iron button results are inconsistent.

Would anyone be willing to critique my solder job to point out other things I should be improving?

I also had a trace lift in the PIA removal so I bridged it with a clipped lead from another component. It seems ok on continuity, but I’d be curious if someone has suggestion for a better fix for next time.

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yaksplat I’m using leadfree (I’ve got young kids in the house) and I have trouble getting something that looks shinier. Should I expect it even with that solder?

I’m using a metcal with 700 degree iron.

Nope, backside and expecting it to wick up.

Ok ok. I'm ordering some leaded solder. That's how I'd started working, but my wife had an issue with it and I figured lead free wouldn't hurt much.