I’m doing a PIA swap out and adding a socket in the process. I’ve been using practice kits for the last few months to get a handle but still having a little trouble getting enough solder to flow through the channel to the pad on the opposite side. When I supply more solder I get a convex blob instead. I *am* making contact with the lead and pad for about a second before adding solder via a bridge to the iron button results are inconsistent.
Would anyone be willing to critique my solder job to point out other things I should be improving?
I also had a trace lift in the PIA removal so I bridged it with a clipped lead from another component. It seems ok on continuity, but I’d be curious if someone has suggestion for a better fix for next time.