Quoted from Dbvandy:a quick suggestion that in your next revision, you draw up the 2N3904 Transistor in a tripod layout.
Consider using 2.54mm hole spacing instead of 1.27mm hole spacing. This will allow use of the formed lead components that are often sold as tape/reel or ammo packs. The bulk (1.27mm) can be manually "widened" (in a straight line) whereas the formed lead (2.54mm) is much harder to "narrow".
Also some more unsolicited feedback for the OP:
I would consider flipping the 8255 180 degrees. It's the only IC that is oriented 180 degrees to the other. For consistency it is good to have all the ICs oriented the same way. I have yet to find a board from a Williams (System 11 and later) machine that has mixed orientation. The ICs are always in the same orientation - presumably for consistency. You have already laid out the tracks and connections so it is some work and the work would warrant not wanting to do this. That's a fair argument against it and in that case it's something to consider for your next board design should you do something new.